Thermal gap pads are resilient and with large deformation, suitable for large institutional design tolerances. Single or Double layer structure, The Double layer is reinforced with special ultra-thin fabric to increase resistance and workability of punching, strip type, Malformation designs. Self-adhesive and never recede. No corrosion to the Copper surface, “enviromentally friendly productsâ€.
Features
Ultra conformable,“gel-like†modulus高å˜å½¢é‡
Designed for low-stress applications低压应用
low hardness 低硬度
Applications
Telecommunications
Computer, Between heat-generating semiconductor and a heat sink
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