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0.12MM Amaoe BGA Reballing Stencil With CPU Position For Phone A8-A14

  • Origin: China
  • Supply Type: oem service
  • Processing Time: 3 days
  • Min Order: 5

Supplier Info.

  • Employees Total 11-50
  • Annual Revenue

Description

Amaoe BGA Reballing Stencil multifunctional plant tin steel net for 6-14 Pro Max, 0.12mm amaoe BGA reballing stencil with CPU hole for A8 A9 A10 A11 A12 A13 A14 A15 A16. Multi-function BGA Reballing Stencil for CPU/font/audio/power IC /USB control IC soldering. High quality Amaoe BGA reballing stencil for CPU IC soldering reballing repair.Option:- for 6/6P A8- for Acirc; 6S/6SP A9- for Acirc; 7/7P A10- for Acirc; 8/8P/X A11- for Acirc; XS/XS MAX/XR A12- for Acirc; 11 Series A13- for Acirc; 12 Series A14- for Acirc; 13 Series A15- for 14 series A16/A15.Package list:1x BGA reballing stencil
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