M-TS060 fiberglass thermally conductive adhesive tape are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
Good thermal conductivity
High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape.
High performance, thermally conductive acrylic
Applications
l Mount heat sink onto BGA grac processor or drive processor.
l Mount heat spreader onto power converter PCB or onto motor control PCB.
l Can be used instead of heat cure adhesive, screw mounting or clip mounting.
Product Configuration
l Sheet sizes : 1040(or 1240)mm×25M/50M
l 0.15~0.5mm thickness optional 0.15~0.5mm
Properties
Property |
M-TS060-015 |
M-TS060-020 |
M-TS060-025 |
Unit |
Test Method |
Backing Type |
Fiberglass | 一 | 一 | ||
Color | White | Visual | Visual | ||
Thermal conductivity | 0.2-0.6 | W/M-K | ASTM D5470 | ||
Temperature range | -20~120 | ℃ | EN344 | ||
Thickness | 0.15±0.03 | 0.20±0.03 | 0.25±0.03 | mm | 一 |
Compressive strength | ≧2 | ≧2.5 | ≧3 | K v/mm | ASTM D149 |
Thermal Impedance @50psi | 0.7 | 0.9 | 1.1 | ℃- in2/W | ASTM D5470 |
Temperature range | -20~120 | ℃ | EN344 | ||
Peel Adhesion | >1000(Steel,lmmediate) | g/inch | PSTC-1 | ||
| >1200(Steel after 24 hrous) | g/inch | PSTC-1 | |||
| Holding Power | >48(1000G*25℃) | H/inch | PSTC-7 | ||
| >48(1000G*80℃) | H/inch | PSTC-7 | |||
Suggested Use of Pressure
| Pressure | Temperature | Time | 一 | 一 |
| 10psi(0.069MPa) | 25℃ | 20sec | 一 | 一 | |
| 10psi(0.069MPa) | 50-75℃ | 5sec | 一 | 一 | |
| Shelf Life | 12 Months(Indoor Temperature should be 25℃ RH:65%,and keep ventilated and dry) | 一 | 一 | ||
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