Gold Bonding wire(Silver, copper wire too)

For Gold Bonding Grain of nd section

: Grain size of the improved [IU type]

is bigger than current

ïƒ Grain size : 35%↑

-. s

: Yield strength of improved [IU type] : 10%↓

: Hardness of improved [IU type] : 12%↓

ïƒ Relatively softer than current

-. 2nd Bonding Window

: 2nd window of improved [IU type] is broader at lower para. areas

ïƒ Easy to deform even by a small force

-. Workability

: MTBA of improved [IU type] shows about two times higher

: The remain areas of improved [IU type] observed more widely

For Silver Bonding ore Coating Types Concept Target Application Status1N Silver

Gold ACA

. Air Bondable Silver ost effectiveness (for Gold)

. Better reliability than Silver alloy

LED, IC Card,

Low-end Memory HVMM MCS

. Air Bondable Silver ost effectiveness (for Gold)

. Better reliability than ACA

High-end Memory LVM2N Silver

Gold *ACA2

. Cost effectiveness (for ACA)

. Anti-Discoloration

. Improving workability

LED, IC Card,

Camera module

Low-end Memory

M *GFS

. Ag Purity > 98.5%

. Resistivity < 2.0uΩcm

. Improving workability

High-end Memory UnderDevelopment 2N Silver NA H4

. High conductivity

. Cost advantage

. Stable workability

LED, Low-end IC HVM

For Copper bonding ore Coating Types Concept Reliability level (Target) Status2N

Copper

Non CA

. Better reliability for

Automotive

. Workability [AEC-Q006_Grade.0]

HTST : 175DegC/4,000hrs

uHAST : 130DegC,RH85%/500hrsHVMGold

Palladium

HAP . Enhanced reliability

for Automotive HVM3N

Copper *HAP2 . Reliability improved

. Resistivity < 2.0uΩcm

[JEDEC] +

HTST : 150DegC/1,000hrs

uHAST : 130DegC,RH85%/168hrsLVM4N Copper

PC . Low Pd coated orkability HVMX (Metal) *NC2 . Low Pd

. Better Reliability

High Purity

Copper Non LV2 . Property customized

for Ball Shape