0.12MM Amaoe BGA Reballing Stencil With CPU Position For Phone A8-A14

FOB Price: USD 2.55 - 2.75
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5 Pieces (Min. Order)
  • Supplying Ability100000 Pieces Per Month
  • Supplying TypeOem service
  • Model NumberAmaoe315
  • Preferred Payment Method:T/T, L/C, D/A, D/P, Western Union, Money Gram, PayPal

Quick Details

  • Processing Time:3 days
  • Port:Shenzhen
  • Supply Ability: 100000 Pieces Per Month
  • Brand Name:Amaoe
Description Amaoe BGA Reballing Stencil multifunctional plant tin steel net for Phone 6-14 Pro Max, 0.12mm amaoe BGA reballing stencil with CPU hole for A8 A9 A10 A11 A12 A13 A14 A15 A16. Multi-function BGA Reballing Stencil for Phone CPU/font/audio/power IC /USB control IC soldering. High quality Amaoe BGA reballing stencil for Phone CPU IC soldering reballing repair. Option: - for Phone 6/6P A8 - for Phone 6S/6SP A9 - for Phone 7/7P A10 - for Phone 8/8P/X A11 - for Phone XS/XS MAX/XR A12 - for Phone 11 Series A13 - for Phone 12 Series A14 - for Phone 13 Series A15 - for Phone 14 series A16/A15. Package list: 1x BGA reballing stencil