Gold Bonding Wire(Silver, Copper Wire Too)

For Gold Bonding wire -. Grain of wire surface and section : Grain size of the improved [IU type] is bigger than current  Grain size : 35%↑ -. Wire properties : Yield strength of improved [IU type] : 10%↓ : Hardness of improved [IU type] : 12%↓  Relatively softer than current -. 2nd Bonding Window : 2nd window of improved [IU type] is broader at lower para. areas  Easy to deform even by a small force -. Workability : MTBA of improved [IU type] shows about two times higher : The remain areas of improved [IU type] observed more widely For Silver Bonding wire:  Core Coating Types Concept Target Application Status1N Silver Gold ACA . Air Bondable Silver wire . Cost effectiveness (for Gold) . Better reliability than Silver alloy LED, IC Card, Low-end Memory HVMM MCS . Air Bondable Silver wire . Cost effectiveness (for Gold) . Better reliability than ACA High-end Memory LVM2N Silver Gold *ACA2 . Cost effectiveness (for ACA) . Anti-Discoloration . Improving workability LED, IC Card, Camera module Low-end Memory  M *GFS . Ag Purity > 98.5% . Resistivity < 2.0uΩcm . Improving workability High-end Memory UnderDevelopment 2N Silver NA H4 . High conductivity . Cost advantage . Stable workability LED, Low-end IC HVM For Copper bonding wire : Core Coating Types Concept Reliability level (Target) Status2N Copper Non CA . Better reliability for Automotive . Workability [AEC-Q006_Grade.0] HTST : 175DegC/4,000hrs uHAST : 130DegC,RH85%/500hrsHVMGold Palladium HAP . Enhanced reliability for Automotive HVM3N Copper *HAP2 . Reliability improved . Resistivity < 2.0uΩcm [JEDEC] + HTST : 150DegC/1,000hrs uHAST : 130DegC,RH85%/168hrsLVM4N Copper PC . Low Pd coated wire . Workability HVMX (Metal) *NC2 . Low Pd . Better Reliability High Purity Copper Non LV2 . Property customized for Ball Shape