Quick Details
- Processing Time:After payment 7-15 working days
- Port:Shenzhen,Guangzhou,HongKong
- Supply Ability: 30 Sets Per Year
- Place of Origin:China
- Laser Type:UV
- Model Number:SMTfly-5L
- Cutting Thickness:0.4-3.2
- Cooling Mode:Air
- Cutting Area:330*330mm(Customized as Customer need)
- Certification:CE ISO9001
- CNC or Not:CNC
- Brand Name:SMTfly
- Application:PCB PCBA FPC
- Brand Name:SMTfly
Printed Circuit Board (PCB) depaneling machinery,UV Fpc Laser Cutting Machine,SMTfly-5L Specification:
Laser
Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength
355nm
Laser Power
10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor
±2μm
Repetition Precision of Worktable of Linear Motor
±1μm
Effective Working Field
460mmX460mm(Customizable)
Laser Scanning Speed
2500mm/s (max)
Galvanometer Working Field Per One Process
40mmх40mm
High capacity BOFA dust collectorUser friendly Window based softwarePCB flexible product jig adjustable for different board sizeHigh resolution and accurate Z stage with auto-focus
functionLarge area low friction front loading platform for sliding multiple product jigsFully covered class 1 safety enclosureAble to do cutting and marking
togetherIncreasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate
systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise
way of singulation without any risk of harming them, regardless of substrate.
PCB Separator,PCB Cutting with Flex Pcb UV Laser Depanelizer Machine with CE Certification
PCB Separator by Using UV Laser Fpc Cutting,SMTfly-5L Features:
Pre-camera vision product position registration and model checkCoherent Avia NX UV laser with HurrySCAN
headCompact size
Video of Laser PCB/FPC Cutting Using Laser with CE Certification Sample:
PCB Depanelizer Machine,FPC Cutter with Flex Pcb Separated Machine,SMTfly-5L Description:
PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die
cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large
boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added
costs of tooling and waste removal associated with mechanical methods.
If you need the
machine,please contact us:
Skype/Email:
WhatsApp/Wechat: +86
136 8490 4990
-depanel