Silicon Wafer Grinder Equipment Buyer and Importer

specifications regarding Silicon Surface Grinding Machine. Input workpiece dimension: 1) Material : Silicon 2) Workpiece size (diameter) : up to 150 mm 3) Initial Thickness : up to 500 microns Output workpiece requirements: 1) Output Thickness : 30 to 80 microns (acc. to user requirement) 2) Flatness : less than 0.2 microns 3) Surface roughness (Rz) : less than 0.2 microns(with grinding) 4) Thickness variation : +/- 1.5 micronsorkpiece size (diameter) : up to 150 mm 3) Initial Thickness : up to 500 microns Output workpiece requirements: 1) Output Thickness : 30 to 80 microns (acc. to user requirement) 2) Flatness : less than 0.2 microns 3) Surface roughness (Rz) : less than 0.2 microns(with grinding) 4) Thickness variation : +/- 1.5 microns Show More