Material: Material: FR4 with standard glass transition (Tg), Routing: Individual (single), Board size: 27mm X 93mm (for Z8 module), 71mm X 102mm (HHU V9), 100mm X 160mm (GU V3) Thickness: 1.6mm, Surface finish: Hot air solder leveling (HASL), Copper weight: 1oz., Solder mask: Both sides, Solder mask colour: Green, Silkscreen legend: 1 side, Silkscreen legend colour: White, Smallest holes: 0.4mm, Minimum trace spacing: 0.2mm. Show More